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Chemical Vapor Deposition, Ion Beam Deposition, Physical Vapor Deposition and Sputtering are only a few of the vacuum deposition technologies used to coat thin metal films on different substrates. In the most advanced technological fields the requirements of extreme purity of the deposited films result in the need of a very clean environment and very tight control on the presence of impurities during the deposition process. A clear example of this is the metal deposition via sputtering, which is a key process in the semiconductor and magnetic data storage manufacturing.
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The use of SAES Getters NEG pumps in these deposition systems guarantees achieving and maintaining the very clean environment required by the extreme purity of the deposited films. In fact, they shorten the pump down time, thus improving the productivity of the equipment, and increase the impurity control during deposition to achieve better film quality.
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Due to their versatility and to their peculiar pumping mechanism, NEG pumps can be installed either in conjunction with the existing main pumping system, such as the CapaciTorr, or they can reside in the process chamber, where they remove impurities without reacting with the argon process gas, such as the InsiTorr. A further evolution of the in-situ pump concept is the WaferGetter, a silicon wafer coated with a layer of NEG material, which results in an actual pump to be moved around and positioned in any chamber needing additional pumping speed.
Boost your product performance with SAES Getters solutions:
- CapaciTorr Pumps
- WaferGetter Pumps
- InsiTorr Pumps
Browse the Product Box for further details.
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